Notes. The above values are based on the reference values determined by the test piece. The actual property values may varydepending on the shape of the product and the operating conditions. The information, suggestions, and opinions provided herein arejust for your consideration, inguiry, and verification purposes, but not construed in port or in whole as worranties ond renresentationswhich constitute our legal liability.
Main Properties of CORESIC® Silicon Carbide 

Fineceratech CORESIC® sintered s仆icon carbide (SSiC) is a polycrystalline alpha type silicon carbide produced from pure submicron SiC powder with non-oxide sintering aids. CORESIC® SiC provides a full range of exce ptional properties makes it an ideal material for glass molding process: 

•    Hig h hardness: 50% higher than tungsten carbide, almost hard as diamond. Even under extreme high temperature and pressure, it also has super wear resistance; high ha「dness also means high purity, which causes less contamina­tion during the processing.

•    High density and low porosity: The actual density of the product is greater than 95% of the theoretical density of SiC, so that it can be processed to reach an effect as ideal mirror.

•    Excellent thermal shock resistance: Due to the excellent thermal conductivity, consistently low thermal expansion coefficient and minimizing internal temperature gradient, CORES IC® SiC has excellent thermal shock resistance and can be more adaptable to the rapid heat cycling than other materials

•    High temperature stability: It can operate under high temperature condi廿ons that other materials cannot meet (maximum operating temperature: 1700°C in air, 1950°C in inert gas), no deformation at high temperature

•    Unparalleled high temperature creep resistance: It can minimize the deformation of the mold.

•    Excellent anti-oxidation performance: Long service life can be achieved.

CORES IC® SG is a special silicon carbide material with high thermal conductivity developed by Fineceratech material scien­tists for glass forming molds. While maintaining the excellent characteristics of CORES IC® SP SiC,it is more easily to be machined than CORESIC® SP, which makes it possible to manufacture SiC molds with large quantities.

CORESIC® SiC for Glass Hot Bending
Although graphite has good properties of easy processing and good thermal conductivity, but it also has poor perfor­mance of oxidation resistance and weak wear resistance at high temperature, which makes the surface of the mold made of graphite easy to spa II and break, and the glass surface is prone to spots, which seriously affects the service life of the glass bending mold and the glass forming accuracy. The 3D glass hot bending mold made of CORESIC® SG SiC can completely solve these problems. It can extend the lifetime of the mold and increase the yield rate of the glass, consequently the operating costs is reduced and productivity is improved. There is a wide range of potentials on the application of the mobile phone cover glass and car screen glass hot bending molds 
The CORESIC® SP SiC heat conduction plate can solve the problem of stainless-steel heating plate which is easily de­formed and service life is short. Sanzer also can provide thermal insulation ceramic material which is microcrystals and has low thermal conductivity and low thermal expansion. It improves the deformation problems in the cooling process and can reduces the energy consumption of the bending machine.

CORESIC® silicon carbide material has the following advantages due to its excellent and comprehensive performance, the glass mold made by it has the following advantages 

•    Excellent surface processing quality, no pores on the surface, smooth optical mirror surface

•    Excellent oxidation resistance at high temperature, the structure does not change, and the surface quality is stable

•    It does not react with the glass or cause adhesion, and the mold is easy to release.

•    The hardness and strength remain the same even under high temperature conditions. It improves the efficiency and solves the problem of the tungsten steel mold which is led by the poor oxidation resistance, low thermal conductivi­ty.